COOLSPAN TECA是热固性的, 基于环氧树脂, silver filled adhesive film used in bonding high power circuit boards. COOLSPAN films provide a convenient and reliable approach to bond high power circuit boards, 重金属背板, 散热器硬币和射频模块外壳. This approach overcomes voiding and flow issues that are problematic for sweat soldering and dispensed adhesive approaches. COOLSPAN TECA films can be tack soldered in a fixture, ensuring accurate registration. This is followed by a tooled thermal cure or PCB press cycle.
- Easily converted into pre-forms and easily handled
- Keeps conductive materials out of stay-out zones
- Provides electrical continuity and heat dissipation to heat sinks