SpeedWave 300P预浸料-电子游艺正规排名

SpeedWave 300P prepreg is offered with multiple spread and open weave glass style and resin content combinations to maximize stackup options. This material exhibits excellent fill and flow capability around heavy copper features, a low z-axis expansion for plated through hole reliability and is CAF耐. SpeedWave 300P prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.

特性

低介电常数(Dk)为3.0 – 3.3在10 GHz
低耗散系数(Df)为0.0019 – 0.0022在10ghz
Incorporates low Dk glass reinforcement with a range of spread and open weave offerings
Excellent fill and flow around heavy copper features
CAF耐
UL 94 - v - 0

好处

Compatible with a variety of Rogers’ high frequency and high speed laminates
Ideal for high layer count designs
Low z-axis expansion for plated through-hole reliability
Capable of multiple sequential laminations
Compatible with FR-4 fabrication processes and lead-free PCB assembly processing

下载

描述	语言	文件大小
数据表
SpeedWave®300P数据表	英语	139KB
SpeedWave 300P	中文	859KB
制造信息
SpeedWave 300P预浸料 Fabrication Guidelines	英语	355KB
速波300P	中文	501KB
(M) SDS /中
SpeedWave 300P预浸料- SDS	英语	138KB
SpeedWave 300P预浸料- SDS	中文	684KB