SpeedWave 300P prepreg is offered with multiple spread and open weave glass style and resin content combinations to maximize stackup options. This material exhibits excellent fill and flow capability around heavy copper features, a low z-axis expansion for plated through hole reliability and is CAF耐. SpeedWave 300P prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.
|SpeedWave 300P预浸料 Fabrication Guidelines||英语||
|(M) SDS /中|
|SpeedWave 300P预浸料- SDS||英语||
|SpeedWave 300P预浸料- SDS||中文||